Thermal Oxide Wafer




Thermal Oxide Wafer




Thermal Oxide Wafer




Thermal Oxide Wafer






SINCE 2002

Research & Innovation


Thermal oxide or silicon dioxide layer is formed on bare silicon surface at elevated temperature in the presence of an oxidant , the process is called thermal oxidation. Thermal oxide is normally grown in a horizontal tube furnace , at temperature range from 900°C ~ 1200°C , using either a "Wet" or "Dry" growth method . Thermal oxide is a kind of "grown" oxide layer , compared to CVD deposited oxide layer , it has a higher uniformity, and higher dielectric strength , it is an excellent dielectric layer as an insulator . In most silicon- based devices, thermal oxide layer play an important role to pacify the silicon surface to act as doping barriers and as surface dielectrics . SWI provides thermal oxide wafer in diameter from 2" to 12 " , we always choose prime grade and defect free silicon wafer as substrate for growing high uniformity thermal oxide layer to meet your specific requirements . Contact us for further information on price & delivery time .







10 nm thin oxide
90 nm dry oxide
285 nm oxide
300 nm oxide
1 um wet oxide
6 um thick oxide

Thermal Oxide Capability

Typically after thermal oxidation process , both front side and back side of silicon wafer have oxide layer . In case only one side oxide layer is required , we can remove back oxide and offer one side thermal oxide wafer for you .

Oxide thickness range Oxidation technique Within wafer
uniformity
Wafer to wafer
uniformity
Surface processed
100 Å ~ 500Å dry oxide +/- 5% +/- 10% both sides
600 Å ~ 1000Å dry oxide +/- 5% +/- 10% both sides
100 nm ~ 300 nm wet oxide +/- 5% +/- 10% both sides
400 nm ~ 1000 nm wet oxide +/- 3% +/- 5% both sides
1 um ~ 2 um wet oxide +/- 3% +/- 5% both sides
3 um ~ 4 um wet oxide +/- 3% +/- 5% both sides
5 um ~ 6 um wet oxide +/- 3% +/- 5% both sides





Thermal Oxide Wafer Application


100 A Tunneling Gates
150 A ~ 500 A Gate Oxides
200 A ~ 500 A LOCOS Pad Oxide
2000 A ~ 5000 A Masking Oxides
3000 A ~ 10000 A Field Oxides

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Product Specification


Qxidation technique Wet oxidation or Dry oxidation                                                
Diameter Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Oxide thickness 100 A ~ 6 um
Tolerance +/- 5%
Surface Single side or double sides oxide layer
Furnace Horizontal tube furnace
Gase Hydrogen and Oxygen gases
Temperature 900 C ° - 1200 C °
Refractive index 1.456

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Thin Film Coating Service




Silicon Nitride ( Si3N4 )

LPCVD silicon nitride as insulation layers application, SWI can offer LPCVD silicon nitride at different stress level with high thickness uniformity and etch rates.

1. Stoichiometric nitride ( >800 Mpa )
2. Low stress nitride ( <250 Mpa )
3. Super low stress nitride ( <100 Mpa )

Metal PVD Deposition

SWI provides more than 100 sputter target materials for the vacuum coating use . Our metal film deposition service includes single layer and/or the combination of the following elements:

Ta, TaN, Cu, Ti, TiN, Al, Al-Si-Cu, Al-Cu, Al-Si, TiW, W, WN, WSi, and Cr.


Multiple Film Stack

SWI can stack multiple film to silicon wafer . we combine and stack oxide, nitride and metal film onto the same silicon substrate .

1. Silicon wafer + SiO2
2. Silicon wafer + SiO2 + Si3N4
3. Silicon Wafer + Cr + Au
4. Silicon Wafer + SiO2 + Ta + Cu