Thermal oxide or silicon dioxide layer is formed on bare silicon surface at elevated
temperature in the presence of an oxidant , the process is called thermal oxidation. Thermal oxide is normally grown in a horizontal tube furnace , at temperature range
from 900°C ~ 1200°C , using either a "Wet" or "Dry" growth method .
is a kind of "grown" oxide layer , compared to CVD deposited oxide layer , it has a
higher uniformity, and higher dielectric strength , it is an excellent dielectric layer as
an insulator . In most silicon- based devices, thermal oxide layer play an important
role to pacify the silicon surface to act as doping barriers and as surface dielectrics .
SWI provides thermal oxide wafer in diameter from 2" to 12 " , we always
choose prime grade and defect free silicon wafer as substrate for growing high uniformity thermal oxide layer to meet your specific requirements .
Contact us for further information on price & delivery time .