Borofloat® Glass Wafer
Anodic Bonding Glass Wafer
 


Borofloat glass have many excellent and unique characteristics as follows ,

1. Low Thermal Expansion Coefficient
Suitable for anodic bonding to silicon .


2. Good Temperature Stability
High thermal shock resistance


3. High Chemical Durability
High resistance to acid / alkali


4. High Transparency
Transmissive in visible and near IR & UV range of wavelengths

These special features makes Borofloat glass wafer as a top choice for many industry applications .



Standard Specification
Round shape Ø 1" / 2" / 3" / 4" / 6" / 8"
Square shape 25 x 25 / 50 x 50 ~ 200 x 200 mm
Thickness 0.5 / 0.7 / 1.1 / 2 mm
Surface finish two sides polished
Surface quality 60 / 40
Mechanical Properties
Density 2.23 g / cm3
Poisson's ratio 0.2
Young's modulus 62.75 G pa
Knoop Hardness 480
Moh's hardness NA
Thermal Properties
Thermal expansion coefficient 3.25 ×10 -6 K-1
Thermal conductivity ( 90 °C ) 1.2 W / (m. K)
Short-term operating temperature 500 °C
Long-term operating temperature 450 °C
Viscosity Properties
Working point 1270 °C
Softening point 820 °C
Annealing point 560 °C
Strain point 518 °C
Electrical Properties
Resistivity ( ohm-cm ) 8@250 °C / 6.5@350 °C
Loss Tangent 37 x 10-4
Dielectric constant 4.6
Optical Properties
Refractive index 1.472
Chemical Properties
Acid resistance class 1
Alkali resistance class 2
Hydrolytic resistance class 1
Composition
SiO2 81%
B2O3 13%
Na2O / K2O 4%
Al2O3 2%

 

         
         
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